BASF has developed the highly fluid Ultrason for high difficulty electronic and electrical components with special requirements ® D 1010 G6 U40. BASF will showcase the innovative applications of this polymer at the upcoming CHINAPLAS 2025.
This blend developed based on polyethersulfone (PESU) can meet the special injection molding requirements for efficient and energy-saving components used in data and energy transmission, intelligent electronic products, and electric vehicles. This new BASF thermoplastic maintains excellent flowability even at lower processing temperatures, giving manufacturers of semiconductor components such as precision switches, circuit breakers, sensors, IGBTs, and aging test sockets more design freedom. Ultrason ® The electrical performance of D 1010 G6 U40 is stable in high temperature environments, with a high relative temperature index (RTI) and a higher CTI value compared to polyetherimide (PEI) and polyphenylene sulfide (PPS). Compared to the standard specification of PESU, injection molding factories using this new blend can lower the temperature of the melt
The degree is reduced by 12.5%, saving energy costs without affecting its excellent liquidity.
High chemical resistance and high temperature resistance
The all-new Ultrason ® The blend not only possesses excellent chemical and high temperature resistance of PESU, but also integrates high rigidity, high strength, good electrical performance, and ease of processing. Compared to the standard specification of PESU Ultrason ® E 2010 G6, It still has better flowability at lower processing temperatures: low viscosity Ultrason ® Under the conditions of a melt temperature of 315 ° C and a mold temperature of 160 ° C, the spiral flow length corresponding to a thickness of 0.5 millimeters for the D specification can reach 3.5 centimeters. The 30% glass fiber reinforced specification formed under 360 ° C temperature conditions has the same flowability as the non reinforced PESU. This makes it possible to manufacture smaller and thinner components, thereby saving assembly space and bringing more design freedom to compact electronic components.
High thermal stability, low water absorption, and high dielectric strength
Ultrason with high liquidity ® The D 1010 G6 U40 also has optimized electrical properties such as excellent thermal stability, low water absorption, and high dielectric strength. It uses halogen-free flame retardants and has excellent electrical RTI values. In internal testing, its 0.4mm thickness rated flame retardant rating is V-0 (UL 94), achieving PLC level 3 according to IEC 60112 standard, and its relative leakage trace index (CTI) is 200V. Compared with PEI and PPS currently used for high difficulty electronic and electrical components, this feature helps achieve miniaturization of electronic and electrical components through lower creepage rates and better insulation performance.
If you want to develop efficient electronic devices with special electrical and mechanical performance requirements, our newly launched Ultrason ® D would be a wise choice BASF Ultrason ® Yoshida Kazuhiro from the Global Business Development Department stated. It not only combines our mature polyether sulfone product Ultrason ® The excellent performance of E, while optimizing electronic and electrical performance, has outstanding fluidity, and can also achieve sustainable utilization of processing energy. This opens up new possibilities for electric vehicles and consumer electronics components. In addition, under harsh working conditions, it also makes applications at higher voltages and data transmission rates safer
Ultrason ® D 1010 G6 U40 is an Ultrason tailored by BASF for the electronics and electrical industry ® Part of the product line: These products can enhance the robustness, durability, and reliability of contemporary and even next-generation electronic and electrical components, thereby driving the development of digitalization, big data, and electric vehicles. These products are particularly suitable for applications with higher performance requirements that other plastics cannot meet.
