BASF has developed a new type of poly (phthalamide) (PPA), which has demonstrated advantages in the manufacturing of IGBT semiconductor casings. The Ultramid Advanced N3U41 G6 product stands out, meeting the needs of electric vehicles, high-speed trains, intelligent manufacturing, and renewable energy. The demand for high-performance and reliable electronic components continues to grow. Semikron Danfoss, as a global technology leader in this field, has now applied BASF PPA to the Semitrans 10 IGBT housing material in its photovoltaic and wind energy system inverters.
The Ultramid Advanced N series has excellent chemical resistance and dimensional stability, which can significantly improve the stability, long-term performance, higher power density, and efficiency of IGBT. IGBT plays an important role in power electronic devices, enabling efficient switching and control of circuits.
IGBT is key component of modern electronic devices, and renewable energy is particularly prominent J ö rn Grossmann from Semikron Danfoss R&D and pre research department stated that IGBT needs to operate under higher temperature conditions while maintaining long-term stability and high performance. The unique characteristics of BASF PPA materials make Semitrans 10 a new paradigm for performance and efficiency. This material can exhibit excellent electrical insulation performance even in harsh environments; Maintain good stability even when short-term temperature peaks occur during the assembly process. That's exactly why we chose this material The combination of high-performance materials and intelligent design can accelerate switching speed, reduce conduction losses, and optimize thermal management, thereby meeting the key requirements of power electronic equipment.
BASF's Ultradur (PBT: polybutylene terephthalate). In the rapidly developing power electronic equipment, the newly launched PPA can meet the numerous requirements of the new generation IGBT. For example, the material can withstand higher temperatures, maintain electrical insulation performance continuously, and maintain dimensional stability under challenging environmental conditions such as humidity, dust, and dirt. The laser sensitive Ultramid Advanced N3U41G6, which uses halogen-free flame retardants, has strong thermal stability, low water absorption, and excellent electrical performance. Its significant feature is a CTI value of up to 600 (CTI: Relative Leakage Traceability Index, according to IEC 60112). Compared with materials currently used for power switches, it has less leakage, better insulation performance, and is more conducive to IGBT miniaturization. The electrical RTI value (RTI: Relative Temperature Index) of UL certified series products can reach up to 150 ° C.
Jochen Seubert, Senior Application Expert at BASF Power Electronics, pointed out that "BASF PPA modified products are supplied globally and provide sample displays. We are customer-oriented and provide technical support for component development, hoping that this innovative material can make an important contribution to the development of power electronics equipment and promote the process of global renewable energy transformation." In the IGBT manufacturing process, BASF PPA is compatible with semiconductor packaging materials after injection molding of metal pins and fixtures.
