On April 7, 2025, Molex, a global leader in the electronics industry and innovator in connectivity technology, will exhibit at the 2025 Munich Shanghai Electronics Show (electronica China) held at the Shanghai New International Expo Center from April 15 to 17, 2025. A series of informative demonstration activities will be held at booth 609 in Hall W3.
Roc Yang, Vice President of Sales at Molex China, said, "China is an important innovative market, and we are committed to providing strong support for the constantly developing technology fields in the country. With the advancement of data centers, automotive, consumer electronics, and medical technologies driven by generative artificial intelligence, machine learning, and cloud solutions, we expect the industry's demand for reliable and durable high-speed interconnect products to continue to grow in the next 12 to 18 months
Yang continued, "To address these challenges, product designers, manufacturing engineers, and supply chain experts need to work more closely together to accelerate innovation in heat dissipation and power management, materials science, and battery technology. Therefore, we actively participate in the Munich Shanghai Electronics Show to connect industry leaders and jointly promote the next wave of innovation
car
In addition to the MX Dash and RNC demonstrations, Molex will also showcase the HSAutoLink cabling solution. The HSAutoLink C connector is designed using mature Type-C connector technology, offering both sealed and non sealed versions. Both versions have been improved according to the rigorous requirements of automobiles, combining multiple connectors into a compact shape to make good use of circuit board space.
Visitors will be able to personally experience how Molex solutions support important applications such as ADAS, information entertainment, electric vehicle power management, and seamless in car networks, which will solidify the company's position as a leader in the automotive connectivity field.
Data center
The Mirror Mezz demonstration will highlight how this stackable fully enclosed mezzanine connector series provides industry-leading signal integrity and up to 224Gbps data rates to meet the growing demands of telecommunications, networking, and high-density applications such as OCP compliant systems. The theme expert will explain on site how Molex's engineering expertise drives high-speed data connectivity, improves energy efficiency in compact designs, and accelerates design cycles, ensuring first-class signal integrity for the next generation of systems.
Consumer and Commercial
Molex will demonstrate high-performance components for numerous mobile devices and smart appliances, among which Nano Fit is a compact high-performance solution for micro power applications. Molex engineers will demonstrate how these space saving connectors provide excellent electrical integrity and reliability, supporting high current applications. These connectors offer a range of configurations, plating options, and color coded/keying designs, making them ideal for precision driven, space limited electronic applications.
